SERVER AIR COOLING

INTEL LGA4677 COMPATIBILITY

 

Designed for Intel LGA4677 socket processors in compact server applications.

 

COPPER,

ALUMINUM,

HEATPIPE COOLING

 

Copper, aluminum and heatpipe construction for heat dissipation in a compact form factor.

CPU cooler airflow and heat pipe diagram

60mm HIGH-SPEED FAN

 

66mm overall height for space-constrained server configurations.

LOW-PROFILE 2U DESIGN

66mm overall height for space-constrained server configurations.

Cooler height compared with an AA battery

DUAL BALL BEARING AND PWM

 

Dual ball bearing fan with 4-pin PWM connection for variable fan control.

HIGH STATIC PRESSURE

 

Specified maximum static pressure of 10.0 mmH₂O.

High static pressure: airflow through the cooler, 10.0 mmH2O

Spezifikationen

Produktname
LGA4677 2U
Produktnummer
LSA-I2H4N-W6N4N-B1
CPU-Sockel*
Intel LGA4677
Heatsink Material
Copper / Aluminum / Heatpipe
Abmessung
118 × 82 × 66 mm
Fan Dimensions
60 × 60 × 25 mm
Lüfter
1 Stück
Bearing
Dual Ball Bearing
Fan Speed
0–9,000 ±10% RPM
Max Airflow
50.3 CFM
Max Static Pressure
25.8 mmH₂O
Geräuschniveau
6–50.8 dBA
Rated Current
0.75 A
Power-Anschluss
4-Pin PWM
Supported CPU TDP
280W @ 9,000 RPM